Vertiv delivers critical infrastructure that powers and protects data centers and networks worldwide.
The Vertiv™ CoolLoop Trim Cooler is the free cooling, AI-ready, densification-ready, environmentally responsible cooling solution from 850W to 3000 kW. This advanced cooling technology enables dense, free cooling chillers to operate efficiently at return water temperatures up to 50°C. It offers the flexibility to scale from traditional compute environments with 20–22°C water supply to hotter AI workloads while maintaining compactness, modularity, and precision. By strategically designing cooling systems to avoid the inefficiencies and risks of static designs, data center owners can seamlessly adapt to the evolving needs of AI-driven infrastructure.
The Vertiv™ CoolChip CDU is designed to support liquid cooling within high density environments. It is suitable for direct-to-chip and rear door cooling applications that offer easy, cost-effective deployment in any data center. The Vertiv CoolChip CDU family has models that operate with and without access to facility water, allowing you to tap into the benefits of liquid-cooled servers to more efficiently support higher rack densities. Select between in-rack, in-row, or perimeter-based designs as well as liquid-to-liquid or liquid-to-air heat exchangers.
The Vertiv™ SmartRun is a prefabricated overhead IT infrastructure system designed for end-to-end speed and simplicity. It integrates high-density power distribution, liquid cooling, networking and containment infrastructure in an all-in-one deliverable platform. High-speed assemblies at Vertiv manufacturing locations worldwide reduce complexity and accelerate deployment time onsite up to 85% faster than traditional stick build methods. It is modular, scalable and configurable to various customer design points, making project deployment at scale with ease.